Personal profile
Education/Academic qualification
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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User experience evaluation of AR assisted industrial maintenance and support applications
Nagy, A., Spyridis, Y., Mills, G. J. & Argyriou, V., Jul 2024, Published in: Proceedings of 2024 the 10th International Conference on Virtual Reality. Piscataway, U.S. : Institute of Electrical and Electronics Engineers, Inc. pp. 270-277, ISBN: 9798350364231 Organising Body: Institute of Electrical and Electronics Engineers Organising Body: Institute of Electrical and Electronics Engineers. p. 270-277Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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User experience evaluation of AR assisted industrial maintenance and support applications
Nagy, A., Spyridis, Y., Mills, G. J. & Argyriou, V., Jul 2024.Research output: Contribution to conference › Paper › peer-review
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AI-powered interfaces for extended reality to support remote maintenance
Nagy, A., Amponis, G., Kyranou, K., Lagkas, T., Boulogeorgos, A. A., Sarigiannidis, P. & Argyriou, V., 1 May 2023, Published in: Simmhan, Y., Altınta┼ƒ, İ., Varbanescu, A., Balaji, P., Prasad, A.S. and Carnevale, L. (eds.) (2023) 2023 IEEE/ACM 23rd International Symposium on Cluster, Cloud and Internet Computing Workshops (CCGridW) Piscataway, U.S. : Institute of Electrical and Electronics Engineers, Inc. pp. 214-222. ISBN 9798350302097. Organising Body: Institute of Electrical Engineers / Association for Computing Machinery Organising Body: Institute of Electrical Engineers / Association for Computing Machinery. p. 214-222Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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AI-powered interfaces for extended reality to support remote maintenance
Nagy, A., Amponis, G., Kyranou, K., Lagkas, T., Boulogeorgos, A. A., Sarigiannidis, P. & Argyriou, V., 1 May 2023.Research output: Contribution to conference › Paper › peer-review