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Mechanical properties of nanoclay reinforced epoxy adhesive bonded joints made with composite materials

  • S. M. R. Khalili
  • , M. Tavakolian
  • , A. Sarabi
  • K.N. Toosi University of Technology
  • Kingston University
  • Amirkabir University of Technology

Research output: Contribution to journal › Conference article › peer-review

Abstract

This study was intended to characterize the mechanical properties of nanoclay filled epoxy adhesive single lap joints under both static (tensile) and dynamic (impact) loadings. The nanoclay contents were 1, 3 and 5 wt% of epoxy resin (Araldite LY5052). The nanoclay particles were dispersed in the epoxy resin by a stirring device and then the mixture of resin and clay particles was subjected to sonication using an ultrasonicator. Glass/epoxy composite adherends were fabricated and used to study the behavior of epoxy adhesive bonded joints. The composite adherend surfaces were prepared according to ASTM D2093. According to ASTM D3165, the properties of the reinforced adhesive in shear were obtained by tension loading of single lap joint specimens. Also, the joints were subjected to in-plane and out-of-plane Charpy impact tests. The results showed that the adhesive joints with 1% nanoclay particles had the maximum strength in tensile loading and the highest values of Charpy impact energy were found for the joints with adhesives filled with 3% nanoclay particles.
Original languageEnglish
Pages (from-to)1917-1928
JournalJournal of Adhesion Science and Technology
Volume24
Issue number11-12
Publication statusPublished - 2010
Externally publishedYes
Event3rd International Conference of Adhesion Science and Technology on Advanced Computational Engineering and Experimenting (ACE-X 2009) - Rome, Italy
Duration: 22 Jun 2009 → 23 Jun 2009

Bibliographical note

Published online: 02 Apr 2012

Keywords

  • nanoclay particles
  • adhesive bond
  • composite adherends
  • impact
  • tensile loading
  • filled thermoplastic polyimides
  • graphite
  • strength
  • films
  • Mechanical, aeronautical and manufacturing engineering

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