@inproceedings{2af1e968870b4339a4cee127b52139d5,
title = "Thermoformed circuit boards: fabrication of highly conductive freeform 3d printed circuit boards with heat bending",
abstract = "Fabricating 3D printed electronics using desktop printers has become more accessible with recent developments in conductive thermoplastic flaments. Because of their high resistance and difculties in printing traces in vertical directions, most applications are restricted to capacitive sensing. In this paper, we introduce Thermoformed Circuit Board (TCB), a novel approach that employs the thermoformability of the 3D printed plastics to construct various double-sided, rigid and highly conductive freeform circuit boards that can withstand high current applications through copper electroplating. To illustrate the capability of the TCB, we showcase a range of examples with various shapes, electrical characteristics and interaction mechanisms. We also demonstrate a new design tool extension to an existing CAD environment that allows users to parametrically draw the substrate and conductive trace, and export 3D printable fles. TCB is an inexpensive and highly accessible fabrication technique intended to broaden HCI researcher participation.",
keywords = "3d printed electronics, Conductive flament, Hybrid additive manufacturing",
author = "Freddie Hong and Connor Myant and David Boyle",
year = "2021",
month = may,
day = "7",
doi = "10.1145/3411764.3445469",
language = "English",
series = "Conference on Human Factors in Computing Systems - Proceedings",
publisher = "Association for Computing Machinery ",
booktitle = "CHI 2021 - Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems",
address = "United States",
note = "2021 CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths, CHI 2021 ; Conference date: 08-05-2021 Through 13-05-2021",
}